EFFECTS OF DEPOSITION METHODS ON THE TEMPERATURE-DEPENDENT RESISTIVITY OF TUNGSTEN FILMS

被引：23

作者：

KRUSINELBAUM, L ^{[1
]}

AHN, K ^{[1
]}

SOUK, JH ^{[1
]}

TING, CY ^{[1
]}

NESBIT, LA ^{[1
]}

机构：

[1] IBM CORP,DIV GEN TECHNOL,ESSEX JUNCTION,VT 05452

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 06期

关键词：

D O I：

10.1116/1.573637

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：3106 / 3110

页数：5

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