SPUTTER-ENHANCED DIFFUSION PHENOMENA IN CU/NI ALLOYS AT ELEVATED-TEMPERATURES

被引:38
作者
SHIMIZU, H [1 ]
ONO, M [1 ]
KOYAMA, N [1 ]
ISHIDA, Y [1 ]
机构
[1] UNIV TOKYO,INST IND SCI,TOKYO 106,JAPAN
关键词
D O I
10.1063/1.331048
中图分类号
O59 [应用物理学];
学科分类号
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页码:3044 / 3052
页数:9
相关论文
共 38 条
[1]   TEMPERATURE DEPENDENCE OF AG/CU SPUTTERING RATIO FOR EUTECTIC [J].
ANDERSON, GS .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (07) :2884-&
[2]  
BEHRISH, 1976, CRITICAL MATERIALS P, pCH3
[3]  
BRONGERSMA HH, 1979, SURF SCI, V84, P31
[4]  
CARTER G, 1969, ION BOMBARDMENT SOLI, P333
[5]   DIFFUSION ENHANCEMENT DUE TO LOW-ENERGY ION-BOMBARDMENT DURING SPUTTER ETCHING AND DEPOSITION [J].
ELTOUKHY, AH ;
GREENE, JE .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (08) :4444-4452
[6]  
GOTO K, 1978, J VAC SCI TECHNOL, V15, P1695
[7]  
GREEN DM, 1980, PLASMA CHEM, V1, P45
[8]   OBSERVATION OF SEGREGATION OF CU TO SURFACE OF A CLEAN, ANNEALED, 50 PERCENT CU-50 PERCENT NI-ALLOY BY AUGER-ELECTRON SPECTROSCOPY [J].
HELMS, CR .
JOURNAL OF CATALYSIS, 1975, 36 (01) :114-117
[9]   AUGER STUDY OF PREFERRED SPUTTERING ON BINARY ALLOY SURFACES [J].
HO, PS ;
LEWIS, JE ;
WILDMAN, HS ;
HOWARD, JK .
SURFACE SCIENCE, 1976, 57 (01) :393-405
[10]  
ISHIDA Y, UNPUB