A FURTHER STUDY OF THE STATE OF RESIDUAL-STRESS IN TIN FILMS MADE BY PHYSICAL VAPOR-DEPOSITION METHODS

The residual stress and strain distribution in TiN films deposited by chemical vapor deposition onto cemented carbide and physical vapor deposition methods onto cemented carbide and stainless steel are studied. Two sets of samples were chosen for study which, respectively, have either strong (111) textures or show different textures apparently resulting from different deposition rates. The data indicate that the residual stress on different planes in all samples, as measured by standard x-ray diffraction methods, is affected by the texture of the film. Reduction in the deposition rate increases the lattice distortion, reduces the strain distribution and the tendency of the (220) plane to show shear stress effects. The data confirm that studies of planes not lying parallel to the surface of the film are needed to allow a more complete characterization and to permit the way to a fuller interpretation to be opened. © 1990, American Vacuum Society. All rights reserved.