ENHANCED CU-TEFLON ADHESION BY PRESPUTTERING PRIOR TO THE CU DEPOSITION

被引：103

作者：

CHANG, CA

BAGLIN, JEE

SCHROTT, AG

LIN, KC

机构：

来源：

APPLIED PHYSICS LETTERS | 1987年 / 51卷 / 02期

关键词：

D O I：

10.1063/1.98637

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：103 / 105

页数：3

共 25 条

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