INTERDIFFUSION MECHANISMS IN AG-AU THIN-FILM COUPLES

被引：43

作者：

KIRSCH, RG ^{[1
]}

POATE, JM ^{[1
]}

EIBSCHUTZ, M ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

APPLIED PHYSICS LETTERS | 1976年 / 29卷 / 12期

关键词：

D O I：

10.1063/1.88944

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：772 / 775

页数：4

共 10 条

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[2] DEPTH PROFILES OF AU OVERLAYERS ON AG FILMS [J].

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SUMMERMATTER, R .

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[3]

GANGULEE A, 1975, THIN SOLID FILMS, V25

[4] DIFFUSION MECHANISMS IN PD-AU THIN-FILM SYSTEM AND CORRELATION OF RESISTIVITY CHANGES WITH AUGER-ELECTRON SPECTROSCOPY AND RUTHERFORD BACKSCATTERING PROFILES [J].

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MORABITO, JM ;

POATE, JM .

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[5]

KIRSCH RG, 1975, THESIS U LYON

[6] THIN-FILM INTERDIFFUSION .1. AU-PD, PD-AU, TI-PD, TI-AU, TI-PD-AU, AND TI-AU-PD [J].

POATE, JM ;

TURNER, PA ;

DEBONTE, WJ ;

YAHALOM, J .

JOURNAL OF APPLIED PHYSICS, 1975, 46 (10) :4275-4283

[7]

POATE JM, UNPUBLISHED

[8]

POATE JM, 1976, ION BEAM SURFACE LAY, P317

[9] DIFFUSION OF GOLD THROUGH POLYCRYSTALLINE SILVER IN THIN-FILMS AT TEMPERATURES NEAR 150 DEGREESC [J].

WOOD, JK ;

ALVAREZ, JL ;

MAUGHAN, RY .

THIN SOLID FILMS, 1975, 29 (02) :359-364

[10]

ZIEGLER JF, 1975, NEW USES LOW ENERGY, pCH2

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