EXCELLENT CHARGE-TRAPPING PROPERTIES OF ULTRATHIN REOXIDIZED NITRIDED OXIDES PREPARED BY RAPID THERMAL-PROCESSING

被引:36
作者
HORI, T
IWASAKI, H
机构
[1] Matsushita Electric Industrial Co, Moriguchi, Jpn, Matsushita Electric Industrial Co, Moriguchi, Jpn
关键词
RAPID THERMAL PROCESSING - REOXIDIZED NITRIDED OXIDES - ULTRATHIN OXIDES;
D O I
10.1109/55.678
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:168 / 170
页数:3
相关论文
共 13 条
[1]   CAPTURE AND TUNNEL EMISSION OF ELECTRONS BY DEEP LEVELS IN ULTRATHIN NITRIDED OXIDES ON SILICON [J].
CHANG, ST ;
JOHNSON, NM ;
LYON, SA .
APPLIED PHYSICS LETTERS, 1984, 44 (03) :316-318
[2]   INTERFACE STATES AND FIXED CHARGES IN NANOMETER-RANGE THIN NITRIDED OXIDES PREPARED BY RAPID THERMAL ANNEALING [J].
HORI, T ;
NAITO, Y ;
IWASAKI, H ;
ESAKI, H .
IEEE ELECTRON DEVICE LETTERS, 1986, 7 (12) :669-671
[3]   ELECTRICAL AND PHYSICAL CHARACTERISTICS OF THIN NITRIDED OXIDES PREPARED BY RAPID THERMAL NITRIDATION [J].
HORI, T ;
IWASAKI, H ;
NAITO, Y ;
ESAKI, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (11) :2238-2245
[4]  
HORI T, 1987, IEDM, P570
[5]  
HORI T, 1987, DEC IEEE SEM INT SPE
[6]  
HORI T, 1987, VLSI S TECH DIG, P63
[7]  
Hsu F.-C., 1984, International Electron Devices Meeting. Technical Digest (Cat. No. 84CH2099-0), P96
[8]   ADVANTAGES OF THERMAL NITRIDE AND NITROXIDE GATE FILMS IN VLSI PROCESS [J].
ITO, T ;
NAKAMURA, T ;
ISHIKAWA, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1982, 29 (04) :498-502
[9]  
Jayaraman R., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P668
[10]  
Lai S. K., 1983, International Electron Devices Meeting 1983. Technical Digest, P190