APPLICATIONS OF WEAR-RESISTANT THICK-FILMS FORMED BY PHYSICAL VAPOR-DEPOSITION PROCESSES

被引：80

作者：

NAKAMURA, K

INAGAWA, K

TSURUOKA, K

KOMIYA, S

机构：

[1] ULVAC CORP,INST SUPER MAT,CHIBA 28912,JAPAN

[2] ULVAC CORP,DIV RES & DEV,CHIGASAKI,KANAGAWA,JAPAN

来源：

THIN SOLID FILMS | 1977年 / 40卷 / JAN期

关键词：

D O I：

10.1016/0040-6090(77)90115-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：155 / 167

页数：13

共 14 条

[1] ACTIVATED REACTIVE EVAPORATION PROCESS FOR HIGH RATE DEPOSITION OF COMPOUNDS [J].

BUNSHAH, RF ;

RAGHURAM, AC .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (06) :1385-&

[2]

GLASKI FA, 1972, 3RD P INT C CHEM VAP

[3]

ITOH A, 1968, 4 P INT VAC C, P536

[4] THERMAL INPUT TO SUBSTRATE DURING DEPOSITION BY HOLLOW-CATHODE DISCHARGE [J].

KOMIYA, S ;

TSURUOKA, K .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (01) :589-592

[5]

KOMIYA S, 1974, JPN J APPL PHYS, P415

[6] PHYSICAL VAPOR-DEPOSITION OF THICK CR AND ITS CARBIDE AND NITRIDE FILMS BY HOLLOW-CATHODE DISCHARGE [J].

KOMIYA, S ;

TSURUOKA, K .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :520-524

[7] THIN-FILM FORMATION OF IN2O3, TIN, AND TAN BY RF REACTIVE ION PLATING [J].

MURAYAMA, Y .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (04) :818-820

[8]

NAKAMURA K, 1974, KINZOKU GAKKAISHI, V38, P913

[9]

NORTON JT, 1963, NASACR321 NAT AER SP

[10]

OGOSHI M, 1955, KAKEN HOKOKU, V31, P103

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