SIMULATION OF ION TRAJECTORIES NEAR SUBMICRON-PATTERNED SURFACE INCLUDING EFFECTS OF LOCAL CHARGING AND ION DRIFT VELOCITY TOWARD A WAFER

被引:40
作者
OOTERA, H
OOMORI, T
TUDA, M
NAMBA, K
机构
[1] Semiconductor Research Laboratory, Mitsubishi Electric Corporation, Tsukaguchi-Honmachi, Amagasaki, Hyogo
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1994年 / 33卷 / 7B期
关键词
ETCHING OF P-DOPED POLYSILICON; ELECTRON CYCLOTRON RESONANCE PLASMAS; LOCAL CHARGING ON SUBMICRON-PATTERNED SURFACE; DEFLECTION OF ELECTRON AND ION TRAJECTORIES; SIDE ETCHING AT POLY-SI SIO2 BOUNDARIES; DRIFT VELOCITY; NUMERICAL SIMULATION;
D O I
10.1143/JJAP.33.4276
中图分类号
O59 [应用物理学];
学科分类号
摘要
Ion trajectories near a submicron-patterned surface were investigated using numerical simulations including effects of local charging on the patterned surface and ion drift velocity toward the wafer. The simulation results were also discussed relative to the etched profile characteristics in electron cyclotron resonance (ECR) plasmas with a divergent magnetic field. Since the pattern size was much smaller than the Debye length, charge neutrality was not satisfied on the submicron-patterned surface. The simulated ion trajectories were largely deflected at the inside of the outermost lines of line-and-space patterns. Moreover, the ion trajectory deflection was reduced with increasing ion drift velocity. These simulation results showed a similar tendency as the etching characteristics.
引用
收藏
页码:4276 / 4280
页数:5
相关论文
共 9 条
[1]   CHARGING OF PATTERN FEATURES DURING PLASMA-ETCHING [J].
ARNOLD, JC ;
SAWIN, HH .
JOURNAL OF APPLIED PHYSICS, 1991, 70 (10) :5314-5317
[2]   LOW-TEMPERATURE CHEMICAL VAPOR-DEPOSITION METHOD UTILIZING AN ELECTRON-CYCLOTRON RESONANCE PLASMA [J].
MATSUO, S ;
KIUCHI, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1983, 22 (04) :L210-L212
[3]  
ONO K, 1993, 11TH P INT S PLASM C
[4]   ELECTRICAL AND OPTICAL MEASUREMENTS OF ELECTRON-CYCLOTRON RESONANCE DISCHARGES IN CL2 AND AR [J].
OOMORI, T ;
TUDA, M ;
OOTERA, H ;
ONO, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (03) :722-726
[5]  
OOMORI T, 39TH SPRING M JAP SO
[6]  
OOMORI T, 1992, SEMICOND WORLD, V11, P94
[7]   SIMULATION OF REACTIVE ION ETCHING PATTERN TRANSFER [J].
SHAQFEH, ESG ;
JURGENSEN, CW .
JOURNAL OF APPLIED PHYSICS, 1989, 66 (10) :4664-4675
[8]  
TOYOTA M, 39TH SPRING M JAP SO
[9]  
TUDA M, 39TH SPRING M JAP SO