MULTILEVEL INTERCONNECTIONS FOR WAFER SCALE INTEGRATION

[1] CALHOUN DF, 1973, 1973 P EL COMP C, P7

[2] Catt I., 1981, Wireless World, V87, P57

[3] A 1-MBIT FULL-WAFER MOS RAM [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (08) : 1612 - 1621

[4] Eggers H., 1985, 1985 Proceedings of the Second International IEEE VLSI Multilevel Interconnection Conference (Cat. No.85CH2197-2), P163

[5] GRINBERG J, 1984, IEEE T COMPUT, V33, P69

[6] HELLER WR, 1984, IEEE DESIGN TEST MAG

[7] THE THIN-FILM MODULE AS A HIGH-PERFORMANCE SEMICONDUCTOR PACKAGE [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 286 - 296

[8] HO CW, 1982, VLSI ELECTRONICS MIC, V5, P103

[9] HU SM, 1984, T IEEE ELECTRON DEVI, V69, P4

[10] POINT-DEFECT YIELD MODEL FOR WAFER SCALE INTEGRATION [J]. IEEE CIRCUITS & DEVICES, 1985, 1 (04): : 24 - 34

[1] CALHOUN DF, 1973, 1973 P EL COMP C, P7

[2] Catt I., 1981, Wireless World, V87, P57

[3] A 1-MBIT FULL-WAFER MOS RAM [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (08) : 1612 - 1621

[4] Eggers H., 1985, 1985 Proceedings of the Second International IEEE VLSI Multilevel Interconnection Conference (Cat. No.85CH2197-2), P163

[5] GRINBERG J, 1984, IEEE T COMPUT, V33, P69

[6] HELLER WR, 1984, IEEE DESIGN TEST MAG

[7] THE THIN-FILM MODULE AS A HIGH-PERFORMANCE SEMICONDUCTOR PACKAGE [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) : 286 - 296

[8] HO CW, 1982, VLSI ELECTRONICS MIC, V5, P103

[9] HU SM, 1984, T IEEE ELECTRON DEVI, V69, P4

[10] POINT-DEFECT YIELD MODEL FOR WAFER SCALE INTEGRATION [J]. IEEE CIRCUITS & DEVICES, 1985, 1 (04): : 24 - 34