A TRANSMISSION ELECTRON-MICROSCOPY STUDY ON TI-N FILMS DEPOSITED BY ION PLATING

被引：17

作者：

WEN, LS

JIANG, X

SI, CY

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 06期

关键词：

D O I：

10.1116/1.573705

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：2682 / 2685

页数：4

共 12 条

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J].

AHN, KY ;

WITTMER, M ;

TING, CY .

THIN SOLID FILMS, 1983, 107 (01) :45-54

[2]

HATSCHEK RL, 1985, AM MACHINIST, V127, P121

[3] THE MICROSTRUCTURE OF REACTIVELY SPUTTERED TI-N FILMS [J].

HIBBS, MK ;

SUNDGREN, JE ;

JACOBSON, BE ;

JOHANSSON, BO .

THIN SOLID FILMS, 1983, 107 (02) :149-157

[4] INITIAL GROWTH OF TIN ON DIFFERENT PHASES OF HIGH-SPEED STEEL [J].

HULTMAN, L ;

HENTZELL, HTG ;

SUNDGREN, JE ;

JOHANSSON, BO ;

HELMERSSON, U .

THIN SOLID FILMS, 1985, 124 (02) :163-170

[5] MICROSTRUCTURES OF TIN AND TI2N DEPOSITS PREPARED BY ACTIVATED REACTIVE EVAPORATION [J].

JACOBSON, BE ;

NIMMAGADDA, R ;

BUNSHAH, RF .

THIN SOLID FILMS, 1979, 63 (02) :333-339

[6]

LAIMER S, 1983, MIKROCHIM ACTA S, V10, P177

[7]

Leamy H. J., 1980, Current topics in materials science. Vol.6, P309

[8] A HIGH-RATE SPUTTERING PROCESS FOR THE FORMATION OF HARD FRICTION-REDUCING TIN COATINGS ON TOOLS [J].

MUNZ, WD ;

HOFMANN, D ;

HARTIG, K .

THIN SOLID FILMS, 1982, 96 (01) :79-86

[9]

RAMALINGAM S, 1984, THIN SOLID FILMS, V118, P355

[10]

SCHIFFER LM, 1983, P AN M AM SOC CLIN, V2, P1

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