Thermal conversion in the vicinity of the surface of a Cr-doped semi-insulating GaAs wafer to n-type conductivity was effectively suppressed by annealing the wafer under arsenic vapor pressure. For the ion implantation of Si into qualified wafers, the arsine-controlled capless-anneal method provided a uniform and reproducible carrier concentration profile which was in good agreement with that predicted by the LSS theory. The doping efficiency of 100% was attained without anomaly due to thermal conversion.