MICROSTRUCTURE, GROWTH, RESISTIVITY, AND STRESSES IN THIN TUNGSTEN FILMS DEPOSITED BY RF SPUTTERING

被引:212
作者
PETROFF, P [1 ]
SHENG, TT [1 ]
SINHA, AK [1 ]
ROZGONYI, GA [1 ]
ALEXANDER, FB [1 ]
机构
[1] BELL LABS, MURRAY HILL, NJ 07974 USA
关键词
D O I
10.1063/1.1662611
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
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页码:2545 / 2554
页数:10
相关论文
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[10]  
SHENG TT, TO BE PUBLISHED