LASER-INDUCED DIODE LINKING FOR WAFER-SCALE INTEGRATION

被引:22
作者
COHEN, SS
WYATT, PW
CHAPMAN, GH
CANTER, JM
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D O I
10.1109/16.2588
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:1533 / 1550
页数:18
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