THERMAL NOISE, DIFFUSION, AND THE MOBILITY OF HOT HOLES IN SILICON

被引:2
作者
BOSMAN, G
ZIJLSTRA, RJJ
机构
来源
PHYSICA STATUS SOLIDI B-BASIC RESEARCH | 1982年 / 109卷 / 02期
关键词
D O I
10.1002/pssb.2221090227
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
引用
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页码:683 / 691
页数:9
相关论文
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