UNIFORMITY OF THIN-FILMS - NEW TECHNIQUE APPLIED TO POLYIMIDES

被引:38
作者
GIVENS, FL
DAUGHTON, WJ
机构
[1] Texas Instruments Incorporated, Dallas
关键词
dielectric films; polyimide; semiconductor processing; thickness profile technique;
D O I
10.1149/1.2129019
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A new technique has been developed for measuring and optimizing the thickness uniformity of spun-on films. The technique allows simple, time-efficient, thickness profile mapping across an entire slice. This technique has been applied to a polyimide to determine the dependence of the film thickness upon dispense volume, dispense spin speed, and final spin speed. The average thickness of the film is a strong function only of the final spin speed, but the uniformity of the film is affected by all three parameters. For the 1100 cP polyimide studied, the optimum spin parameters are: 0.5 cm3 dispense volume; zero dispense spin speed; and ≥ 5K rpm final spin speed. © 1979, The Electrochemical Society, Inc. All rights reserved.
引用
收藏
页码:269 / 272
页数:4
相关论文
共 10 条
  • [1] DAUGHTON WJ, 1978, P KODAK MICROELECTRO
  • [2] DAVIS M, 1978, MAY EL SOC M SEATTL
  • [3] GIVENS FL, UNPUBLISHED
  • [4] KELLY R, 1965, P KODAK SEMINAR MICR
  • [5] OHAGAN P, 1977, P KODAK MICROELECTRO
  • [6] PLISKIN WA, 1978, MAY EL SOC M SEATTL
  • [7] NEW TRANSISTOR WITH 2-LEVEL METAL-ELECTRODES
    SAIKI, A
    HARADA, S
    OKUBO, T
    MUKAI, K
    KIMURA, T
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (10) : 1619 - 1622
  • [8] TAYLOR CJ, 1966, CR597 NASA
  • [9] RHEOLOGY AND MODELING OF SPIN COATING PROCESS
    WASHO, BD
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1977, 21 (02) : 190 - 198
  • [10] ZIELINSKI LB, 1978, MAY EL SOC EXT ABSTR, P274