We examine the direct bonding of (001) InP and (110) GaAs and demonstrate its application to device fabrication. Cross-sectional observation shows that these wafers can be united without generating dislocation. (001) M-based 1.55-mu m wavelength lasers are fabricated on (110) GaAs. The light-current characteristics of the lasers are almost identical to those of lasers fabricated on (001) GaAs, while the turn-on voltage is higher by about 0.4 V due to the large band discontinuity. The results show that the direct bonding technique is promising for allowing new concept ''free-orientation integration.'' (C) 1995 American Institute of Physics.