USE OF SPUTTERED CONDUCTOR MATERIALS IN FILM INTEGRATED-CIRCUITS

[1] BALL DJ, TO BE PUBLISHED

[2] BARRETT CS, 1966, STRUCTURE METALS, P447

[3] Berry R.W., 1968, THIN FILM TECHNOLOGY

[4] BERRY RW, 1968, THIN FILM TECHNOLOGY, P661

[5] STRESS AND RESISTIVITY CONTROL IN SPUTTERED MOLYBDENUM FILMS AND COMPARISON WITH SPUTTERED GOLD [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 699 - &

[6] Chopra K. L., 1969, THIN FILM PHENOMENA

[7] Cullity B. D., 1956, ELEMENTS XRAY DIFFRA

[8] SOURCES OF ERROR IN X-RAY MEASUREMENTS OF RESIDUAL STRESS [J]. JOURNAL OF APPLIED PHYSICS, 1964, 35 (06) : 1915 - &

[9] ALUMINUM FILMS DEPOSITED BY RF SPUTTERING [J]. METALLURGICAL TRANSACTIONS, 1970, 1 (03): : 725 - &

[10] HANFMANN AM, 1968, 4 P INT VAC C MANCH, P549

[1] BALL DJ, TO BE PUBLISHED

[2] BARRETT CS, 1966, STRUCTURE METALS, P447

[3] Berry R.W., 1968, THIN FILM TECHNOLOGY

[4] BERRY RW, 1968, THIN FILM TECHNOLOGY, P661

[5] STRESS AND RESISTIVITY CONTROL IN SPUTTERED MOLYBDENUM FILMS AND COMPARISON WITH SPUTTERED GOLD [J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 699 - &

[6] Chopra K. L., 1969, THIN FILM PHENOMENA

[7] Cullity B. D., 1956, ELEMENTS XRAY DIFFRA

[8] SOURCES OF ERROR IN X-RAY MEASUREMENTS OF RESIDUAL STRESS [J]. JOURNAL OF APPLIED PHYSICS, 1964, 35 (06) : 1915 - &

[9] ALUMINUM FILMS DEPOSITED BY RF SPUTTERING [J]. METALLURGICAL TRANSACTIONS, 1970, 1 (03): : 725 - &

[10] HANFMANN AM, 1968, 4 P INT VAC C MANCH, P549