EFFECT OF LOW-MOLECULAR-WEIGHT NOVOLAK RESIN ON MICROGROOVES

被引：2

作者：

NAKANO, R ^{[1
]}

HIROSE, M ^{[1
]}

SANTOH, N ^{[1
]}

NAKAGAWA, K ^{[1
]}

SHIGEMATSU, K ^{[1
]}

机构：

[1] FUJITSU VLSI LTD,SEMICOND PROC LAB,KUWANA 51101,JAPAN

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1991年 / 30卷 / 11B期

关键词：

MICROGROOVE; PHOTORESIST; NOVOLAK RESIN; PEB; DISSOLUTION INHIBITION; SOLUBILITY;

D O I：

10.1143/JJAP.30.3121

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Microgrooves, by our definition, mean the deformed bottom profile-a protrusion and an undercut - of photoresist patterns, a problem encountered in high-resolution photoresist involving a postexposure bake (PEB). Microgrooves degrade process stability. In studying the relationship between microgrooves and photoresist materials, we found that microgrooves can be suppressed by reducing the content of low-molecular-weight novolak resin, and they are caused by excess dissolution inhibition and imbalanced solubility.

引用

页码：3121 / 3124

页数：4

共 5 条

[1]

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[3]

NAKANO R, 1990, 1990 P KTI MICR SEM, P109

[4] OBSERVATION OF INTERNAL STRUCTURE OF A POSITIVE PHOTORESIST IMAGE USING CROSS-SECTIONAL EXPOSURE METHOD [J].

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[5]

YANAGISAWA H, 1975, 8TH P S SEM INT CIRC, P49

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