THERMAL-STABILITY OF WSIN-GAAS AND AU-WSIN INTERFACES

被引:19
作者
SUGAHARA, H
NAGANO, J
机构
[1] NTT LSI Laboratories, Atsugi-shi, Kanagawa, 243-01, 3-1, Morinosato-Wakamiya
关键词
D O I
10.1016/0169-4332(89)90058-5
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The thermal stability of a Au/WSiN/GaAs system is studied. Current-voltage characteristics of Schottky diodes and depth profiles measured by secondary ion mass spectrometry and Auger electron spectroscopy indicate that both WSiN-GaAs and Au-WSiN interfaces are stable up to at least 800°C. The radial distribution functions for WSiN films determined by extended X-ray absorption fine structure of tungsten L3 edge suggest that nitrogen atoms are located at the interstitial-like sites of the amorphous W-Si network. It is clarified that WSiN films effectively suppress the diffusion of Ga, As, and Au atoms because an amorphous structure free from grain boundaries is maintained even after annealing at 800°C, and nitrogen atoms plug up the interstitial-like sites. © 1989.
引用
收藏
页码:207 / 211
页数:5
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