P-CHANNEL MOSFETS WITH ULTRATHIN N2O GATE OXIDES

被引:25
作者
LO, GQ
TING, W
AHN, J
KWONG, DL
机构
[1] Microelectronics Research Center, Department of Electrical and Computer Engineering, University of Texas, Austin, TX.
关键词
D O I
10.1109/55.144975
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports the performance and reliability of p-channel MOSFET's utilizing ultrathin (approximately 62 angstrom) gate dielectrics grown in pure N2O ambient. Unlike (reoxidized) NH-3-nitrided oxide devices, p-MOSFET's with N2O-grown oxides show improved performance in both linear and saturation regions compared to control devices with gate oxides grown in O2. Because both electron and hole trapping are suppressed in N2O-grown oxides, the resulting p-MOSFET's show considerably enhanced immunity to channel hot-electron and -hole-induced degradation (e.g., hot-electron-induced punchthrough (HEIP)).
引用
收藏
页码:111 / 113
页数:3
相关论文
共 18 条
[1]   CHANNEL HOT-CARRIER STRESSING OF REOXIDIZED NITRIDED OXIDE P-MOSFETS [J].
DUNN, GJ ;
KRICK, JT .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (04) :901-906
[2]   INVERSION LAYER MOBILITY UNDER HIGH NORMAL FIELD IN NITRIDED-OXIDE MOSFETS [J].
HORI, T .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1990, 37 (09) :2058-2069
[3]   ELECTRICAL AND PHYSICAL-PROPERTIES OF ULTRATHIN REOXIDIZED NITRIDED OXIDES PREPARED BY RAPID THERMAL-PROCESSING [J].
HORI, T ;
IWASAKI, H ;
TSUJI, K .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (02) :340-350
[4]  
HORI T, 1990 IEDM, P837
[5]  
HORI T, 1989 IEDM, P459
[6]  
IWAI H, 1990 S VLSI TECH, P131
[7]  
KOYANAGI M, 1986 IEDM, P722
[8]   CIRCUIT PERFORMANCE OF CMOS TECHNOLOGIES WITH SILICON DIOXIDE AND REOXIDIZED NITRIDED OXIDE GATE DIELECTRICS [J].
LEE, SW ;
CHAN, TY ;
WU, AT .
IEEE ELECTRON DEVICE LETTERS, 1990, 11 (07) :294-296
[9]  
LO GQ, 1991 P S VLSI TECH O, P43
[10]  
MATSUOKA F, 1988 IEDM, P18