CHEMICAL VAPOR-DEPOSITION OF TUNGSTEN (CVD W) AS SUB-MICRON INTERCONNECTION AND VIA STUD

被引：26

作者：

LEE, PI

CRONIN, J

KAANTA, C

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1989年 / 136卷 / 07期

关键词：

D O I：

10.1149/1.2097203

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：2108 / 2112

页数：5

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