FORMATION OF AMORPHOUS INTERLAYERS BY SOLID-STATE DIFFUSION IN ULTRAHIGH-VACUUM-DEPOSITED POLYCRYSTALLINE NB AND TA THIN-FILMS ON (111)SI

被引:9
作者
CHENG, JY
CHEN, LJ
机构
[1] Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu
关键词
D O I
10.1063/1.104438
中图分类号
O59 [应用物理学];
学科分类号
摘要
The formation of amorphous interlayers (alpha-interlayers) in ultrahigh-vacuum-deposited polycrystalline Nb and Ta thin films on (111)Si has been studied by cross-sectional transmission electron microscopy. The growth of alpha-interlayers was found to follow a linear growth law initially in samples annealed at 450-500-degrees-C and 550-625-degrees-C for Nb/Si and Ta/Si, respectively. The growth then slows down and deviates from a linear growth behavior as a critical thickness of the alpha-interlayer was reached. The alpha-interlayer/crystalline Si interface was found to be rather smooth. The roughness of the interface between the Nb layer and alpha-interlayer was observed to decrease with annealing temperature and time. The observation suggested that the growth of the alpha-interlayer was interface reaction controlled initially.
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页码:45 / 47
页数:3
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