OXIDATION BEHAVIOR OF CU-NI(MN) (CONSTANTAN) FILMS

被引：27

作者：

BRUCKNER, W

BAUNACK, S

REISS, G

LEITNER, G

KNUTH, T

机构：

[1] FRAUNHOFER INST CERAM TECHNOL & SINTERED MAT,D-01277 DRESDEN,GERMANY

[2] MICROTECH GMBH,D-14513 TELTOW,GERMANY

来源：

THIN SOLID FILMS | 1995年 / 258卷 / 1-2期

关键词：

ALLOYS; DEPTH PROFILING; ELECTRICAL PROPERTIES AND MEASUREMENTS;

D O I：

10.1016/0040-6090(94)06358-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The oxidation of constantan films has been investigated using Cu-Ni( Mn) single films and (Cu-Ni(Mn))-NiCr film configurations by measurements of electrical resistance and Auger electron spectra depth profiling, as well as by thermogravimetric and differential thermoanalytical studies. Oxidation starts under air and argon atmosphere between 300 and 350 degrees C. Under an N-2-H-2 gas mixture a passivating film formed by a double layer of manganese and chromium oxide reduces further oxidation strongly on the Cu-Ni(Mn) film with an NiCr adhesion layer. Further details of the oxidation mechanism are discussed in connection with the film recrystallization. A 60 nm NiCr covering layer protects well against oxidation.

引用

页码：252 / 259

页数：8

共 22 条

[1] INFLUENCE OF THE SUBSTRATE ON THE ANNEALING BEHAVIOR OF SPUTTER-DEPOSITED NI-CR FILMS [J].