THE TEMPERATURE-DEPENDENCE OF COMPONENT FAILURE RATE

被引：15

作者：

BLANKS, HS

机构：

来源：

关键词：

D O I：

10.1016/0026-2714(80)90211-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：297 / 307

页数：11

共 20 条

[1]

ANDERSON RT, 1975, RDH376 IITRI ROM AIR

BLANKS, HS .

MICROELECTRONICS AND RELIABILITY, 1976, 15 (03) :213-219

[3]

Boddy P. J., 1976, 14th Annual Proceedings Reliability Physics, P108, DOI 10.1109/IRPS.1976.362728

[4]

BURROWS RW, 1973, 1973 ANN REL MAINT S, P42

[5]

CARPENTER MR, 1975, ADA014345 NTIS

[6]

CHRISTENSEN R, 1965, CR242 NASA

[7]

FACKLER W, 1972, SVM9 SHOCK VIBR INF, P8

[8]

Fitch W. T., 1975, 13th Annual Proceedings of Reliability Physics Symposium, P58, DOI 10.1109/IRPS.1975.362677

[9]

Glasstone S, 1941, THEORY RATE PROCESSE

[10]

Hamiter L., 1977, 15th Annual Proceedings Reliability Physics, P240, DOI 10.1109/IRPS.1977.362799