共 51 条
[31]
[32]
[33]
[35]
Selected failure mechanisms of modern power modules.[J].Mauro Ciappa.Microelectronics Reliability.2002, 4
[37]
Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules.[J].A. Hamidi;N. Beck;K. Thomas;E. Herr.Microelectronics Reliability.1999, 6
[39]
Substrate-to-base solder joint reliability in high power IGBT modules.[J].E. Herr;T. Frey;R. Schlegel;A. Stuck;R. Zehringer.Microelectronics Reliability.1997, 10

