EFFECT OF ACID DIFFUSION ON RESOLUTION OF A CHEMICALLY AMPLIFIED RESIST IN X-RAY-LITHOGRAPHY

被引:100
作者
NAKAMURA, J
BAN, H
DEGUCHI, K
TANAKA, A
机构
[1] NTT LSI Laboratories, Atsugi-shi, Kanagawa, 243-01
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 1991年 / 30卷 / 10期
关键词
X-RAY LITHOGRAPHY; CHEMICALLY AMPLIFIED RESIST; PREBAKING; POSTEXPOSURE BAKING (PEB); ACID; DIFFUSION COEFFICIENT;
D O I
10.1143/JJAP.30.2619
中图分类号
O59 [应用物理学];
学科分类号
摘要
The diffusion range of acids in a chemically amplified positive resist (EXP) was quantitatively evaluated using a contact replication method. The acid diffusion range reached a maximum depth of 0.4-mu-m. The acid diffusion range was diminished, as the temperature of prebaking was raised or the temperature of post-exposure baking (PEB) was reduced. The acid diffusion range also exerted a great influence on changing the replicated pattern width dependence on exposure dose. To clarify the effect of the acid diffusion on the characteristics of the resist, the distribution of the acid-catalyzed reaction in the resist and the acid diffusion range were calculated using the diffusion coefficient of the acid and the acid-catalyzed reaction rate constant determined by experiments. The calculated acid diffusion range coincided rather well with that obtained by the contact replication method.
引用
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页码:2619 / 2625
页数:7
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