ELECTROMIGRATION IN AL/CU/AL FILMS OBSERVED BY TRANSMISSION ELECTRON-MICROSCOPY

被引:25
作者
HOROWITZ, SJ
BLECH, IA
机构
来源
MATERIALS SCIENCE AND ENGINEERING | 1972年 / 10卷 / 03期
关键词
D O I
10.1016/0025-5416(72)90082-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
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页码:169 / &
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共 14 条
[1]   REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].
AMES, I ;
DHEURLE, FM ;
HORSTMANN, RE .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) :461-+
[2]   ELECTROMIGRATION DAMAGE OF GRAIN-BOUNDARY TRIPLE POINTS IN A1 THIN FILMS [J].
BERENBAUM, L .
JOURNAL OF APPLIED PHYSICS, 1971, 42 (02) :880-+
[3]  
BERENBAUM L, 1971, P RELIABILITY PHYS S
[4]   ELECTROMIGRATION IN THIN AL FILMS [J].
BLECH, IA ;
MEIERAN, ES .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) :485-&
[5]   EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J].
DHEURLE, FM .
METALLURGICAL TRANSACTIONS, 1971, 2 (03) :683-&
[6]   EFFECT OF ALLOY ADDITIONS ON ELECTROMIGRATION FAILURES IN THIN ALUMINUM FILMS [J].
GANGULEE, A ;
DHEURLE, FM .
APPLIED PHYSICS LETTERS, 1971, 19 (03) :76-&
[7]   SOME OBSERVATIONS ON ELECTROMIGRATION IN ALUMINUM FILMS [J].
GHATE, PB .
APPLIED PHYSICS LETTERS, 1967, 11 (01) :14-&
[8]   CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J].
HUNTINGTON, HB ;
GRONE, AR .
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) :76-87
[9]  
OHRING M, 1971, J APPL PHYS, V42, P2563
[10]   CURRENT-INDUCED MASS TRANSPORT IN ALUMINUM [J].
PENNEY, RV .
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1964, 25 (03) :335-&