DEPOSITION BY EVAPORATION OF CU-AL ALLOY-FILMS

被引：15

作者：

DHEURLE, F ^{[1
]}

ALLIOTA, C ^{[1
]}

ANGILELLO, J ^{[1
]}

BRUSIC, V ^{[1
]}

DEMPSEY, J ^{[1
]}

IRMISCHER, D ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

关键词：

D O I：

10.1016/0042-207X(77)90017-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：321 / 327

页数：7

共 29 条

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