AN ANALYTICAL MODEL OF DIFFUSION CURRENT IN INTRINSICALLY GETTERED STRUCTURES BASED ON INTENTIONAL CONTAMINATION EXPERIMENTS

被引:10
作者
PEARCE, CW [1 ]
JACCODINE, RJ [1 ]
机构
[1] LEHIGH UNIV,SOLID STATE MAT,BETHLEHEM,PA 18015
关键词
D O I
10.1109/16.83743
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have used the results of intentional iron implants into bulk wafers with intrinsic gettering to develop an analytical model suitable for calculating the diffusion current in both bulk and epitaxial wafer structures. The model is used to compare the improvement in diffusion current an epitaxial wafer provides over a bulk wafer. For typical structures factors reductions in diffusion current of 10 to 100 x are predicted when using epitaxial wafers.
引用
收藏
页码:2155 / 2160
页数:6
相关论文
共 10 条
[1]   OXYGEN PRECIPITATION EFFECTS ON SI-N+-P JUNCTION LEAKAGE BEHAVIOR [J].
CHAKRAVARTI, SN ;
GARBARINO, PL ;
MURTY, K .
APPLIED PHYSICS LETTERS, 1982, 40 (07) :581-583
[2]   CATASTROPHIC BREAKDOWN IN SILICON-OXIDES - THE EFFECT OF FE IMPURITIES AT THE SIO2-SI INTERFACE [J].
HONDA, K ;
NAKANISHI, T ;
OHSAWA, A ;
TOYOKURA, N .
JOURNAL OF APPLIED PHYSICS, 1987, 62 (05) :1960-1963
[3]   ORIGIN AND ELIMINATION OF DEFECTS IN SIO2 THERMALLY GROWN ON CZOCHRALSKI SILICON SUBSTRATE [J].
ITSUMI, M ;
KIYOSUMI, F .
APPLIED PHYSICS LETTERS, 1982, 40 (06) :496-498
[4]  
PEARCE CW, 1982, VLSI SCI TECHNOLOGY, P53
[5]  
PEARCE CW, 1985, REDUCED TEMPERATURE, P400
[6]  
PEARCE CW, 1988, THESIS LEHIGH U BETH
[7]   IDENTIFICATION, ANNIHILATION, AND SUPPRESSION OF NUCLEATION SITES RESPONSIBLE FOR SILICON EPITAXIAL STACKING-FAULTS [J].
ROZGONYI, GA ;
DEYSHER, RP ;
PEARCE, CW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (12) :1910-1915
[8]   A NEUTRON-ACTIVATION ANALYSIS STUDY OF THE SOURCES OF TRANSITION GROUP METAL CONTAMINATION IN THE SILICON DEVICE MANUFACTURING PROCESS [J].
SCHMIDT, PF ;
PEARCE, CW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (03) :630-636
[9]   IMPACT OF SILICON SUBSTRATES ON LEAKAGE CURRENTS [J].
SLOTBOOM, JW ;
THEUNISSEN, MJJ ;
DEKOCK, AJR .
IEEE ELECTRON DEVICE LETTERS, 1983, 4 (11) :403-406
[10]  
TICE WK, 1977, APPL PHYS LETT, V30, P175