TITANIUM NITRIDE DEPOSITION IN AN RF DISCHARGE

The deposition of titanium nitride (TiN) on a steel substrate from TiCl//4 in an N//2 or an N//2-H//2 plasma obtained in an r. f. discharge was investigated. It was found that the addition of H//2 to the N//2 plasma promoted the formation of TiN, and that the substrate temperature could be much lower than that used in ordinary chemical vapor deposition processes.