BOND WIRELESS MULTICHIP PACKAGING TECHNOLOGY FOR HIGH-SPEED CIRCUITS

A new multichip packaging technology has been developed for use in the advanced hybrid integration of semiconductor chips made of different materials. The resulting multichip module (MCM) is similar to a monolithic circuit in that all the interconnects are made by photolithography and thin film metallization. Any semiconductor chip can be integrated in this scheme without special chip metallization patterns or the incorporation of special features on the chips. In this new technique, chips with backside contacts, such as laser diodes and photodetectors, can be packaged, offering greater flexibility and speed than other hybrid or multichip packaging technologies. Several different optoelectronic receivers which combine various GaAs, Si, and GaInAs chips have been successfully integrated and operated at frequencies ranging from 100 MHz to above 1 GHz.