HIGH-TEMPERATURE INTERACTION STUDIES OF C/CU/SIO2/SI AND RELATED STRUCTURES

被引：18

作者：

CHANG, CA

机构：

来源：

JOURNAL OF APPLIED PHYSICS | 1989年 / 66卷 / 03期

关键词：

D O I：

10.1063/1.344454

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

收藏

页码：1163 / 1169

页数：7

相关论文

共 22 条

[1]

BARCZ A, 1976, ION BEAM SURFACE LAY, P407

[2] ION BACKSCATTERING ANALYSIS OF INTERDIFFUSION IN CU-AU THIN-FILMS [J].

BORDERS, JA .

THIN SOLID FILMS, 1973, 19 (02) :359-370

[3] DETERMINATION OF CONCENTRATION PROFILE IN THIN METALLIC-FILMS - APPLICATIONS AND LIMITATIONS OF HE+ BACKSCATTERING [J].

CAMPISANO, SU ;

FOTI, G ;

GRASSO, F ;

RIMINI, E .

THIN SOLID FILMS, 1975, 25 (02) :431-440

[4] STRUCTURAL STUDIES OF THE EFFECTS OF SILVER AND GOLD ON THE YBACUO SUPERCONDUCTING FILMS FORMED FROM LAYER STRUCTURES [J].

CHANG, C .

JOURNAL OF APPLIED PHYSICS, 1988, 64 (04) :1991-1994

[5] FORMATION OF PALLADIUM SILICIDE IN THE PRESENCE OF AL WITH AND WITHOUT A CARBON BARRIER LAYER [J].

CHANG, CA .

APPLIED PHYSICS LETTERS, 1989, 54 (17) :1656-1658

[6] EFFECTS OF SILVER AND GOLD ON THE YBACUO SUPERCONDUCTING THIN-FILMS WITH THE USE OF AG-CU-BAO-Y2O3 AND AU-CU-BAO-Y2O3 STRUCTURES [J].

CHANG, CA .

APPLIED PHYSICS LETTERS, 1988, 52 (11) :924-926

[7] CARBON AS A BARRIER FOR THE OUTDIFFUSION OF CU [J].

CHANG, CA ;

YEE, DS ;

PETKIE, R .

APPLIED PHYSICS LETTERS, 1989, 54 (25) :2545-2547

[8] INTERACTIONS BETWEEN AU AND CU ACROSS A NI BARRIER LAYER [J].

CHANG, CA .

JOURNAL OF APPLIED PHYSICS, 1986, 60 (03) :1220-1222

[9] ENHANCED CU-TEFLON ADHESION BY PRESPUTTERING PRIOR TO THE CU DEPOSITION [J].

CHANG, CA ;

BAGLIN, JEE ;

SCHROTT, AG ;

LIN, KC .

APPLIED PHYSICS LETTERS, 1987, 51 (02) :103-105

[10] ENHANCED CU-TEFLON ADHESION BY PRESPUTTERING TREATMENT - EFFECT OF SURFACE-MORPHOLOGY CHANGES [J].

CHANG, CA .

APPLIED PHYSICS LETTERS, 1987, 51 (16) :1236-1238