INTERACTIONS OF CU WITH COSI2, CRSI2 AND TISI2 WITH AND WITHOUT TINX BARRIER LAYERS

Interactions of Cu with CoSi2, CrSi2, and TiSi2 with and without interposed TiN(x) layers have been studied using Rutherford backscattering spectrometry, Auger electron spectrometry, x-ray diffraction, and in situ sheet resistivity measurements. Cu diffuses through a preformed CoSi2 layer to form the structure CoSi2/Cu3Si/Si(100). No dissociation of CoSi2 has been observed. For the Cu/CrSi2/Si system, the outdiffusion of Si leads to the formation of Cu3Si/CrSi2/Si at temperatures above 300-degrees-C. At about the same temperature, Cu diffuses into a TiSi2 layer and to the TiSi2/Si interface to react with both Ti and Si forming Cu3, Ti, Cu3Si, and Cu4Si phases. A 50-nm TiN(x) layer prepared by reactive sputtering was observed to be an effective diffusion barrier between Cu and CoSi2 or CrSi2. A 30-nm layer of TiN(x) simultaneously grown with TiSi2 by rapid thermal annealing proved effective between Cu and TiSi2 up to 500-degrees-C.