HIGH DOSE ION-IMPLANTATION INTO PHOTORESIST

被引:62
作者
OKUYAMA, Y
HASHIMOTO, T
KOGUCHI, T
机构
关键词
D O I
10.1149/1.2131665
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:1293 / 1298
页数:6
相关论文
共 7 条
[1]   RANGE AND STRAGGLE OF BORON IN PHOTORESIST [J].
BACCARANI, G ;
PICKAR, KA .
SOLID-STATE ELECTRONICS, 1972, 15 (02) :239-+
[2]   DEPLETION-MODE IGFET MADE BY DEEP ION-IMPLANTATION [J].
EDWARDS, JR ;
MARR, G .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1973, ED20 (03) :283-289
[3]  
GIBBONS JF, 1975, PROJECTED RANGE STAT
[4]  
Hashimoto T., 1976, International Electron Devices Meeting. (Technical digest), P198
[5]   ION-BOMBARDMENT-INDUCED IMPROVEMENT OF PHOTORESIST MASK PROPERTIES FOR RF SPUTTER-ETCHING [J].
IIDA, Y ;
OKABAYASHI, H ;
SUZUKI, K .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1977, 16 (08) :1313-1318
[6]  
MACPHERSON MR, 1971, APPL PHYS LETT, V18, P502, DOI 10.1063/1.1653513
[7]  
OKUYAMA Y, 1973, DENKI KAGAKU, V41, P482