ELECTROMIGRATION IN GOLD AND COPPER THIN-FILM CONDUCTORS

被引：15

作者：

MILLER, RJ ^{[1
]}

GANGULEE, A ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

THIN SOLID FILMS | 1980年 / 69卷 / 03期

关键词：

D O I：

10.1016/0040-6090(80)90590-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：379 / 386

页数：8

共 20 条

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[2]

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[7] ELECTROMIGRATION IN CONDUCTOR STRIPES UNDER PULSED DC POWERING [J].

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[8] ACTIVATION-ENERGY FOR ELECTROMIGRATION AND GRAIN-BOUNDARY SELF-DIFFUSION IN GOLD [J].

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[9]

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[10] METALLIZATION IN MICROELECTRONICS [J].

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THIN SOLID FILMS, 1977, 45 (01) :69-84

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