DEPOSITION OF IN-SITU BORON-DOPED POLYCRYSTALLINE SILICON FILMS AT REDUCED PRESSURES

We report on the deposition of in situ boron-doped polycrystalline Si films on the SiO2 surface with reduced growth pressures at 550 degrees C. The deposition rate of these films decreased as the doping level was greater than 10(19) cm(-3). Such a result is in sharp contrast to what has been observed previously for similar films grown with conventional low pressure chemical vapor deposition techniques. It was also found that the incubation time prior to the deposition of these films diminished as the doping level was increased to 3x10(20) cm(-3) or higher. It is attributed to the preferential adsorption of boron atoms on the SiO2 surface at the initial stage of growth, which facilitates the nucleation of Si.