SPUTTER-INDUCED SUBSURFACE SEGREGATION IN A CU-NI ALLOY

被引：21

作者：

REHN, LE

DANYLUK, S

WIEDERSICH, H

机构：

[1] Materials Science Division, Argonne National Laboratory, Argonne

[2] Department of Materials Engineering, University of Illinois at Chicago Circle, Chicago

来源：

PHYSICAL REVIEW LETTERS | 1979年 / 43卷 / 19期

关键词：

D O I：

10.1103/PhysRevLett.43.1437

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

Measurements of the surface composition of a Cu-Ni alloy using Auger electrons with different average escape depths reveal sputter-induced subsurface compositional changes at elevated temperatures which are larger than those produced directly at the surface by preferential sputtering. The compositional gradients which are produced extend to significantly greater depths than have been considered previously. © 1979 The American Physical Society.

引用

页码：1437 / 1440

页数：4

共 12 条

[1] SURFACE PROCESSES IN PLASMA WALL INTERACTIONS [J].