MICROFABRICATED STRUCTURES FOR THE INSITU MEASUREMENT OF RESIDUAL-STRESS, YOUNGS MODULUS, AND ULTIMATE STRAIN OF THIN-FILMS

被引:181
作者
ALLEN, MG
MEHREGANY, M
HOWE, RT
SENTURIA, SD
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D O I
10.1063/1.98460
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O59 [应用物理学];
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页码:241 / 243
页数:3
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共 17 条
[11]   COPPER POLYIMIDE MATERIALS SYSTEM FOR HIGH-PERFORMANCE PACKAGING [J].
JENSEN, RJ ;
CUMMINGS, JP ;
VORA, H .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (04) :384-393
[12]  
Maissel L.I., 1970, HDB THIN FILM TECHNO
[13]  
MEHREGANY M, 1986, THESIS MIT
[14]  
MEHREGANY M, 1986, 1986 IEEE SOL STAT S
[15]  
PETERSON KE, 1982, IEEE T ELECTRON DEVI, V5, P420
[16]   PROPERTIES OF THIN POLYIMIDE FILMS [J].
ROTHMAN, LB .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (10) :2216-2220
[17]  
TIMOSHENKO S, 1940, THEORY PLATES SHELLS, pCH9