INFLUENCE OF LOW-ENERGY BOMBARDMENT OF AN RF MAGNETRON SPUTTERING DISCHARGE ON TEXTURE FORMATION AND STRESS IN ZNO FILMS

In an oxygen planar RF magnetron sputtering discharge, the time-averaged flux and energy of positive ions drifting out of the plasma and striking the substrate surface have been determined as a function of RF discharge power over a range of 100 to 1000 W, and as a function of chamber pressure from 0.2 to 6 Pa by measurement of ion-current density and time-averaged plasma sheath potential at the substrate. These data were related to the resulting crystal structure of the deposited ZnO films which had been studied in detail using well-known methods of X-ray diffraction. The impact energy of the positive ions bombarding the growing film varies from some 10 eV to close 50 eV depending on magnetron RF discharge power and oxygen pressure, respectively. The incident ion flux was found to be below 1 X 10(15) cm-2 s-1 Up to 1 X 10(16) cm-2 s-1, a value of the same order of magnitude as that for the condensing rate of sputtered ZnO species. The structural results obtained show that both the ion energy and the ion flux in the range mentioned above cause significant changes in the degree of crystallinity, preferred orientation and texture sharpness of the deposited ZnO films. Furthermore, positive ion bombardment during film growth has been found to alter the ZnO unit cell dimension up to 2% relative to the equilibrium bulk or powder value which is responsible for the formation of strong compressive residual stress of up to several GPa within the ZnO film. Following these results, one of the criterions for preparing highly c-axis oriented ZnO films with columnar grain structure is to decrease both the energy and the flux of the positive ion bombardment without decreasing the deposition rate of ZnO species. At a such slight-bombardment RF magnetron deposition the compressive residual stress of the ZnO film can be reduced towards zero.