INTERMETALLIC COMPOUNDS OF AL AND TRANSITIONS METALS - EFFECT OF ELECTROMIGRATION IN 1-2-MUM-WIDE LINES

被引：109

作者：

HOWARD, JK ^{[1
]}

WHITE, JF ^{[1
]}

HO, PS ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.325369

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：4083 / 4093

页数：11

共 18 条

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ANDERSON, JC
[J]. THIN SOLID FILMS, 1972, 12 (01) : 1 - &
[3] BOWER RW, 1973, APPL PHYS LETT, V23, P99, DOI 10.1063/1.1654823
[4] PRINCIPLES AND APPLICATIONS OF ION-BEAM TECHNIQUES FOR ANALYSIS OF SOLIDS AND THIN-FILMS
CHU, WK
MAYER, JW
NICOLET, MA
BUCK, TM
AMSEL, G
EISEN, F
[J]. THIN SOLID FILMS, 1973, 17 (01) : 1 - 41
[5] DEHOFF RT, 1968, QUANTITATIVE MICROSC, P228
[6] DHeurle F. M., 1973, PHYS THIN FILMS, V7, P257
[7] DHEURLE FM, 1973, NATURE BEHAVIOR GRAI, P339
[8] KIRKENDALL STUDY OF ELECTROMIGRATION IN THIN-FILMS
HO, PS
LEWIS, JE
HOWARD, JK
[J]. THIN SOLID FILMS, 1975, 25 (02) : 301 - 315
[9] HO PT, UNPUBLISHED
[10] HOWARD J, UNPUBLISHED