MICROSTRUCTURE OF REACTIVELY SPUTTERED OXIDE DIFFUSION-BARRIERS

被引：18

作者：

KOLAWA, E ^{[1
]}

NIEH, CW ^{[1
]}

SO, FCT ^{[1
]}

NICOLET, MA ^{[1
]}

机构：

[1] HEWLETT PACKARD CO,SAN JOSE,CA 95131

来源：

关键词：

D O I：

10.1007/BF02652129

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：425 / 432

页数：8

共 20 条

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[7] KOLAWA E, 1987, TUNGSTEN OTHER REFRA, V2, P311
[8] KOLAWA E, UNPUB THIN SOLID FIL
[9] CHARACTERIZATION OF REACTIVELY SPUTTERED RUTHENIUM DIOXIDE FOR VERY LARGE-SCALE INTEGRATED METALLIZATION
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