INTERACTIONS IN CO-SI THIN-FILM SYSTEM .2. DIFFUSION-MARKER EXPERIMENTS

被引：100

作者：

VANGURP, GJ ^{[1
]}

VANDERWEG, WF ^{[1
]}

SIGURD, D ^{[1
]}

机构：

[1] RES INST PHYS,S-10405 STOCKHOLM,SWEDEN

来源：

关键词：

D O I：

10.1063/1.325360

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：4011 / 4020

页数：10

共 29 条

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[J]. THIN SOLID FILMS, 1973, 17 (01) : 1 - 41
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[J]. THIN SOLID FILMS, 1975, 25 (01) : 253 - 264
[9] GRAIN-BOUNDARY DIFFUSION AND GROWTH OF INTERMETALLIC LAYERS - NB3SN
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