COLUMNAR GRAIN-STRUCTURE IN THICK SPUTTERED NICKEL

[1] BOONE DH, 1974, J VAC SCI TECHNOL, V11

[2] BUNSHAH RF, 1973, METALL T, V4

[3] BUNSHAH RF, 1974, J VAC SCI TECHNOL, V11

[4] MICROSTRUCTURAL ANALYSIS AND TENSILE PROPERTIES OF THICK COPPER AND NICKEL SPUTTER DEPOSITS [J]. THIN SOLID FILMS, 1977, 40 (JAN) : 345 - 353

[5] COLUMNAR MICROSTRUCTURE IN VAPOR-DEPOSITED THIN-FILMS [J]. THIN SOLID FILMS, 1977, 47 (03) : 219 - 233

[6] FLANDERS DC, 1978, APPL PHYS LETT, V32, P10

[7] CRYSTALLOGRAPHIC ORIENTATION OF SILICON ON AN AMORPHOUS SUBSTRATE USING AN ARTIFICIAL SURFACE-RELIEF GRATING AND LASER CRYSTALLIZATION [J]. APPLIED PHYSICS LETTERS, 1979, 35 (01) : 71 - 74

[8] HECHT RJ, 1975, J VAC SCI TECHNOL, V12

[9] Movchan B. A., 1969, Fizika Metallov i Metallovedenie, V28, P653

[10] EFFECTS OF DEPOSITION TEMPERATURE AND SUBSTRATE BIAS ON ORIENTATION AND HARDNESS OF THICK SPUTTER DEPOSITED BERYLLIUM FOILS [J]. JOURNAL OF THE LESS-COMMON METALS, 1973, 30 (03): : 351 - 359

[1] BOONE DH, 1974, J VAC SCI TECHNOL, V11

[2] BUNSHAH RF, 1973, METALL T, V4

[3] BUNSHAH RF, 1974, J VAC SCI TECHNOL, V11

[4] MICROSTRUCTURAL ANALYSIS AND TENSILE PROPERTIES OF THICK COPPER AND NICKEL SPUTTER DEPOSITS [J]. THIN SOLID FILMS, 1977, 40 (JAN) : 345 - 353

[5] COLUMNAR MICROSTRUCTURE IN VAPOR-DEPOSITED THIN-FILMS [J]. THIN SOLID FILMS, 1977, 47 (03) : 219 - 233

[6] FLANDERS DC, 1978, APPL PHYS LETT, V32, P10

[7] CRYSTALLOGRAPHIC ORIENTATION OF SILICON ON AN AMORPHOUS SUBSTRATE USING AN ARTIFICIAL SURFACE-RELIEF GRATING AND LASER CRYSTALLIZATION [J]. APPLIED PHYSICS LETTERS, 1979, 35 (01) : 71 - 74

[8] HECHT RJ, 1975, J VAC SCI TECHNOL, V12

[9] Movchan B. A., 1969, Fizika Metallov i Metallovedenie, V28, P653

[10] EFFECTS OF DEPOSITION TEMPERATURE AND SUBSTRATE BIAS ON ORIENTATION AND HARDNESS OF THICK SPUTTER DEPOSITED BERYLLIUM FOILS [J]. JOURNAL OF THE LESS-COMMON METALS, 1973, 30 (03): : 351 - 359