FLUOROPOLYMER METALLIZATION FOR MICROELECTRONIC APPLICATIONS

One of the most important requirements for the fastest microelectronic devices in present use, and for the even faster devices for future use, is the reduction of the signal interconnection delay time to a small fraction of all the switching delay times. The interconnection delay time is the produce of the resistance of the metal interconnection and the capacitance of the associated dielectric. One method of lowering this delay time is the use of multilayer devices incorporating low resistivity metals (e.g., Cu) and low capacitance dielectrics (e.g., fluoropolymers). Among the many problems faced in the construction of multilayer devices from these materials is the lack of metal adhesion to fluoropolymers. This article attempts to put into perspective the problem of metal adhesion to fluoropolymers by addressing the reason for its necessity. properties and techniques and discussing the presently available results.