A SENSITIVE BENDING BEAM APPARATUS FOR MEASURING STRESS IN EVAPORATED THIN FILMS

被引：77

作者：

WILCOCK, JD

CAMPBELL, DS

机构：

[1] Electrical Engineering Department, Imperial College, London

来源：

THIN SOLID FILMS | 1969年 / 3卷 / 01期

关键词：

D O I：

10.1016/0040-6090(69)90107-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A bakeable capacity method apparatus for measuring the stress in evaporated films is described. It is comparable in sensitivity to the surface probe (inductive) method. A successful technique for the measurement of the substrate Young's Modulus using the same apparatus is also given. © 1969.

引用

页码：3 / +

页数：1

共 30 条

[1]

ANDERSON J, 1966, USE THIN FILMS PHYSI, P261

[2] DEVELOPMENT OF STRESS AND SURFACE TEMPERATURE DURING DEPOSITION OF LITHIUM FLUORIDE FILMS [J].