INTERCONNECTION AND ELECTROMIGRATION SCALING THEORY

[1] OPTIMAL INTERCONNECTION CIRCUITS FOR VLSI [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (05) : 903 - 909

[2] BAKOGLU HB, 1985, MAY S VLSI TECHN, P54

[3] BHATT HJ, 1970, OCT IEDM, P48

[4] ELECTROMIGRATION FAILURE MODES IN ALUMINUM METALLIZATION FOR SEMICONDUCTOR DEVICES [J]. PROCEEDINGS OF THE IEEE, 1969, 57 (09) : 1587 - &

[5] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) : 338 - &

[6] ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) : 307 - &

[7] MEASUREMENT OF STRESS GRADIENTS GENERATED BY ELECTROMIGRATION [J]. APPLIED PHYSICS LETTERS, 1977, 30 (08) : 387 - 389

[8] ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (04) : 1203 - 1208

[9] Chatterjee P. K., 1980, IEEE Electron Device Letters, VEDL-1, P220, DOI 10.1109/EDL.1980.25295

[10] ANODIZATION OF ALUMINUM TO INHIBIT HILLOCK GROWTH DURING HIGH TEMPERATURE PROCESSING [J]. THIN SOLID FILMS, 1971, 8 (05) : R47 - &

[1] OPTIMAL INTERCONNECTION CIRCUITS FOR VLSI [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (05) : 903 - 909

[2] BAKOGLU HB, 1985, MAY S VLSI TECHN, P54

[3] BHATT HJ, 1970, OCT IEDM, P48

[4] ELECTROMIGRATION FAILURE MODES IN ALUMINUM METALLIZATION FOR SEMICONDUCTOR DEVICES [J]. PROCEEDINGS OF THE IEEE, 1969, 57 (09) : 1587 - &

[5] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) : 338 - &

[6] ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) : 307 - &

[7] MEASUREMENT OF STRESS GRADIENTS GENERATED BY ELECTROMIGRATION [J]. APPLIED PHYSICS LETTERS, 1977, 30 (08) : 387 - 389

[8] ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (04) : 1203 - 1208

[9] Chatterjee P. K., 1980, IEEE Electron Device Letters, VEDL-1, P220, DOI 10.1109/EDL.1980.25295

[10] ANODIZATION OF ALUMINUM TO INHIBIT HILLOCK GROWTH DURING HIGH TEMPERATURE PROCESSING [J]. THIN SOLID FILMS, 1971, 8 (05) : R47 - &