ELECTROMIGRATION IN THIN ALUMINUM FILMS ON TITANIUM NITRIDE

被引：970

作者：

BLECH, IA ^{[1
]}

机构：

[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

JOURNAL OF APPLIED PHYSICS | 1976年 / 47卷 / 04期

关键词：

D O I：

10.1063/1.322842

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1203 / 1208

页数：6

共 18 条

[1]

AGRAWALA BN, 1970, J APPL PHYS, V41, P169

[2] COATING, MECHANICAL CONSTRAINTS, AND PRESSURE EFFECTS ON ELECTROMIGRATION [J].

AINSLIE, NG ;

WELLS, OC ;

DHEURLE, FM .

APPLIED PHYSICS LETTERS, 1972, 20 (04) :173-&

[3] NUCLEATION OF VACANCY CONDENSATION CAVITIES ON (100), (111) AND (110) METAL-OXIDE INTERFACES OF ALUMINUM [J].

ANTHONY, TR .

ACTA METALLURGICA, 1970, 18 (05) :471-&

[4] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J].

BERENBAUM, L ;

ROSENBERG, R .

THIN SOLID FILMS, 1969, 4 (03) :187-+

[5] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J].

BLACK, JR .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) :338-&

[6] CORRECTION [J].

BLECH, IA .

JOURNAL OF APPLIED PHYSICS, 1972, 43 (02) :762-&

[7] ELECTROMIGRATION IN THIN GOLD-FILMS ON MOLYBDENUM SURFACES [J].

BLECH, IA ;

KINSBRON, E .

THIN SOLID FILMS, 1975, 25 (02) :327-334

[8] ELECTROMIGRATION IN THIN AL FILMS [J].

BLECH, IA ;

MEIERAN, ES .

JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) :485-&

[9] ELECTROMIGRATION AND CREVICE FORMATION IN THIN METALLIC FILMS [J].

BLECH, IA .

THIN SOLID FILMS, 1972, 13 (01) :117-&

[10]

BLECH IA, 1965, AF306023776 CONTR

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