TIP-CHIP BONDING - SOLDER BONDING TO THE SIDES OF SUBSTRATES

被引：2

作者：

CHAN, WK

YIYAN, A

BHAT, R

机构：

[1] Bellcore, Red Bank, NJ 07701

来源：

ELECTRONICS LETTERS | 1992年 / 28卷 / 18期

关键词：

OPTOELECTRONICS; INTEGRATED OPTICS; PHOTODETECTORS;

D O I：

10.1049/el:19921100

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A method of butt coupling a photodetector chip to the output facet of waveguides by solder bonding is described. The critical step of defining contact pads on the facet that are well aligned to the waveguides is carried out with a temporary shadow mask fabricated in situ. All of the light emerging from the waveguide is collected with little sensitivity to wavelength, polarisation and details of the device structure.

引用

收藏

页码：1730 / 1732

页数：3

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