REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .1. INITIAL CHARACTERIZATION

被引：9

作者：

PANOUSIS, NT ^{[1
]}

HALL, PM ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 03期

关键词：

D O I：

10.1109/TPHP.1977.1135201

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：305 / 309

页数：5

共 15 条

[1]

FEKULA RG, IN PRESS

[2] FORMALISM FOR DETERMINING GRAIN-BOUNDARY DIFFUSION-COEFFICIENTS USING SURFACE ANALYSIS [J].

HALL, PM ;

MORABITO, JM .

SURFACE SCIENCE, 1976, 59 (02) :624-630

[3] DIFFUSION MECHANISMS IN PD-AU THIN-FILM SYSTEM AND CORRELATION OF RESISTIVITY CHANGES WITH AUGER-ELECTRON SPECTROSCOPY AND RUTHERFORD BACKSCATTERING PROFILES [J].

HALL, PM ;

MORABITO, JM ;

POATE, JM .

THIN SOLID FILMS, 1976, 33 (01) :107-134

[4] STRENGTH OF GOLD-PLATED COPPER LEADS ON THIN-FILM CIRCUITS UNDER ACCELERATED AGING [J].

HALL, PM ;

PANOUSIS, NT ;

MENZEL, PR .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :202-205

[5] INTERDIFFUSION IN CU-AU THIN-FILM SYSTEM AT 25DEGREESC TO 250DEGREESC [J].

HALL, PM ;

MORABITO, JM ;

PANOUSIS, NT .

THIN SOLID FILMS, 1977, 41 (03) :341-361

[6] FORMALISM FOR EXTRACTING DIFFUSION-COEFFICIENTS FROM CONCENTRATION PROFILES [J].

HALL, PM ;

MORABITO, JM .

SURFACE SCIENCE, 1976, 54 (01) :79-90

[7]

JOHNSON DR, 1973, 4TH PLAT EL IND S AM, P272

[8]

Morabito J. M., 1976, Scanning Electron Microscopy 1976. I, P221

[9]

NIKA RJ, TO BE PUBLISHED

[10] OXYGEN EMBRITTLEMENT OF COPPER LEADS [J].

PANOUSIS, NT ;

WONSIEWICZ, BC ;

CONDRA, LW .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (02) :127-132

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