MODULAR MICROCHANNEL COOLED HEATSINKS FOR HIGH AVERAGE POWER LASER DIODE-ARRAYS

被引：87

作者：

BEACH, R ^{[1
]}

BENETT, WJ ^{[1
]}

FREITAS, BL ^{[1
]}

MUNDINGER, D ^{[1
]}

COMASKEY, BJ ^{[1
]}

SOLARZ, RW ^{[1
]}

EMANUEL, MA ^{[1
]}

机构：

[1] UNIV CALIF LAWRENCE LIVERMORE NATL LAB, LASER ISOTOPE SEPARAT PROGRAM, SPECT & KINET GRP, LIVERMORE, CA 94550 USA

来源：

IEEE JOURNAL OF QUANTUM ELECTRONICS | 1992年 / 28卷 / 04期

关键词：

D O I：

10.1109/3.135215

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Detailed performance results for an efficient and low thermal impedance laser diode array heatsink are presented. High duty factor or even CW operation of fully filled laser diode arrays is enabled at high average power. Low thermal impedance is achieved using a liquid coolant and laminar flow through microchannels. The microchannels are fabricated in silicon using an anisotropic chemical etching process. A modular rack-and-stack architecture is adopted for the heat-sink design, allowing arbitrarily large two-dimensional arrays to be fabricated and easily maintained. The excellent thermal control of the microchannel cooled heatsinks is ideally suited to pump array requirements for high average power crystalline lasers because of the stringent temperature demands that result from coupling the diode light to several nanometers wide absorption features characteristic of lasing ions in crystals.

引用

页码：966 / 976

页数：11

共 25 条

[1] HIGH-RELIABILITY SILICON MICROCHANNEL SUBMOUNT FOR HIGH AVERAGE POWER LASER DIODE-ARRAYS [J].